Daitron

Low Noise Power Supplies

Switching Power Supply Introducing our ultra low noise switching power supply products, using an original method and designed to meet the power source demands of high precision measurement instruments and medical devices. Offering ultra Isolation transformer products to attenuate common mode noise as well as systems. As part of the Daitron Group business policy of integrating manufacturing with sales, marketing efforts will be focused on a new series of products aimed at scoring high in customer satisfaction.

Highly Reliable Interconnects

Glass-Filled hermetically sealed connectors Daitron’s state-of-the-art glass-filled hermetic connectors are ideal for systems that require excellent airtightness and can be used for high vacuum and high-pressure vessels based on hermetic sealing technology.

Kirari NINJA

Automatic Photographic Device for Marine Engine Cylinder ・ Kirari NINJA is a device for taking photographs inside engine cylinders. ・ It will contribute to the efficiency of maintenance work.

Chip Tester

The chip testers pick up laser diode chips on a sheet, measure and evaluate various characteristics, and sort them based on the results. The measurement stages are equipped with the temperature control function to characterize devices in the required temperature ranges.

Cleaving Machine

The cleaving machines automatically perform parallel alignment and positioning and cleave with the blade the silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN, from the scribed positions. It is capable for processing maximum of 4-inch wafers and wafer-to-bar cleaving, bar-to-chip cleaving, and full cleaving are available. Unlike dicing machines, the cleaving is dry-processing, not using water, and it is applicable separating into chips one by one as it is not cleaving with roller. The device pattern registered for each recipe is recognized in image processing and used for the parallel alignment.

Scribe Machine

The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN. It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip　scribing, and full scribing are available. Unlike dicing machines, the scribing is dry-processing, not using water. The device pattern registered for each recipe is recognized in image processing and used for the parallel alignment.

Visual Inspection Machine

The visual inspection machines capture high-definition images of semiconductor products and transparent objects such as glass and perform the measurements for scratches, particulates and debris, chipping, color unevenness, dimensions of devices and so forth through the image processing technology. The inspection and evaluation are automatically performed by placing devices on the stage and making the initial setting. The visual inspection machine is for the inspection of the top surface only, but we also offer the models for automatic inspection up to six sides.

Wafer Edge Grinders

The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical control. Our edge grinders are attracting attention as requirements become more stringent for precision and processing quality of wafer edge and circumference. They are also attracting attention as the measures for knife edge to improve the yield in the device process. We provide solutions for various requirements from customers and challenges with our edge grinders.