WBM-2000 Series

  • Summary/Feature
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  • Basic specifications
  • introductory example

・This machine is designed to form an edge bevel on 2 inch to 8 inch diameter wafers.
・The range of materials that can be processed includes silicon and many other semiconductive substrates.
・This model replaces the well established DE(N)P series.

Feature 1 Compact Design

・Compared with existing model DENP-250A, 50% less foot print area.
 DENP-250A…W2,280×1,385 (3,158㎡)
 WBM-2200 …W1,300×1,200 (1,560㎡)

Feature 2 High Accuracy & High machine stiffness

High Accuracy & High machine stiffness

・By utilizing one piece cast iron frame, the vibration during grinding was better controlled and damage on wafer edge,which is a primary cause of chipping, was minimized.

・To obtain higher stiffness of the spindle unit, Z axis movement from spindle was eliminated.

Feature 3 OF Linearity Improved by 33%

・OF linearity specification has been improved from 15um to 10um.
・By consolidating X-Y- θ -Z unit into one unit, instead of having two separate moving units, OF linearity specification has been improved.
・Grinding wheel change can be accomplished with convenient access from the side. The result is higher productivity with less down time.

OF Linearity Improved by 33% OF Linearity Improved by 33%

Feature 4 High Efficiency

・Max 163 wfrs / hr with max speed of 22 sec / wfr. (15 sec / wfr using dual axis model)

・with wafer exchange time of 10 sec / wfr (WBM-2200)

・Motor used for Grinding Y axis and Grinding Z axis were converted from stepping motor to AC servomotor for higher precision.

・Mechanical layout of the machine was also renewed.

・Wafer Transfer unit is relocated to center of both grinding stations to minimize the transfer distance.

Feature 5 Easy Maintenance&Easy Operation

Easy Maintenance

Improved accessibility to all internal mechanisms and controls makes the WBM-2000 easier to maintain. Grinding wheel change can be accomplished with convenient access from the side. The result is higher productivity with less down time.

Easy Operation

Operator control using LCD touch panel and easy to understand menu screens.

※All claims are in comparison to conventional machine.
※There may be variations depending on machine configuration specifications and wafer type.

Inquiries

Daito Electron Corporation Business promotion department
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