Wafer Edge Grinder

  • For ~φ6-inch ~φ8-inch
  • For ~φ12-inch
Product Line Up

Wafer Edge (Peripheral & Notch) Contouring Machine CVP-310B

Summary
  • This ground-breaking chamfering system can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel.
  • Edge processing of the device wafer prior to BG decreases the amount of wafer breakage or chipping after BG.
  • Compact design,Single grinding station
Feature
  • Single grinding station.
  • Compact design: Footprint is downsized by 28%, compared to the conventional machine, CVP-310R.
  • Enhanced processing accuracy and shortened processing time by using the "Twin-contouring" method, compared to the conventional machine.
  • Reduced processing time compared to the conventional machine.
  • With diameter measurement built in, the diameter of a processed wafer is measured and can be used for feedback correction of the processing data.
Basic specifications
Wafer type OF or Notch
Wafer size 12-inch or 8-inch, 6-inch
Loading/Unloading 4-cassette (or 2-cassette) or 1 dry stack-to-1 dry stack (selectable)
Thickness measurement unit Multi-point or a center point measurement (Optional)
Fine alignment Edge contact or Non-edge contact (selectable)
Qty of grind axis One station
Spindle [1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[2] Vertical circumference contouring (finish)
Resin bonded wheel (60mm)
[3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
[4] Notch grinding (horizontal)
Metal-bonded wheel (optional)
Washing unit Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) Optional
Diameter measurement Included

Wafer Edge (Peripheral & Notch) Contouring Machine  CVP-320

Summary
  • This ground-breaking chamfering system can form a trapezoid or radius shape on the edge of an AS-slice wafer using the same resin-bonded wheel.
  • Edge processing of the device wafer prior to BG decreases the amount of wafer breakage or chipping after BG.
Feature
  • Two grinding stations
  • Enhanced processing accuracy and shortened processing time by using the "Twin-contouring" method, compared to the conventional machine.
  • Reduced processing time compared to the conventional machine.
  • A built-in wafer profile measurement device is available.
  • Enables measurement of the cross-section profile after processing for feedback correction of the processing data.
Basic specifications
Wafer type Notch
Wafer size 12-inch or 8-inch (selectable)
Loading/Unloading 8-cassette or 2 dry stacks to 6-cassette or 4-cassette (or 2-casstte) (selectable)
Thickness measurement unit Multi-point measurement
Fine alignment Edge contact or Non-edge contact
Qty of grind axis Two stations
Spindle [1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[2] Vertical circumference contouring (finish)
Resin bonded wheel (60mm)
[3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
[4] Notch grinding (horizontal)
Metal-bonded wheel (Optional)
Washing unit Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
Profile measurement Measurement items: cross-section profile, notch profile, diameter, notch vertical surface width

Inquiries

Daito Electron Corporation Business promotion department
Product Inquiry