Wafer Edge Grinder

  • For ~φ6-inch ~φ8-inch
  • For ~φ12-inch
Product Line Up

Wafer Edge Grinder CVP-80

Summary
  • The CVP series has been developed for higher precision chamfering through the use of a vertical grinding (contouring) wheel.
  • The CVP series chamfers the wafer edge to form a trapezoid or radius shape by using a single resin-bonded wheel.
  • Asymmetric grinding of the device wafer prior to BG results in a reduction of wafer breakage or chipping after BG.
Feature
  • 2-spindle (Max) Simplified chamfering machine with one grinding station.
  • Grinds hard-material wafers (sapphire, SiC, GaN, crystal, quartz) with high precision and no chipping.
Basic specifications
Wafer type OF(CF) or Notch/td>
Wafer size 2-inch to 8-inch
Loading/Unloading None
Thickness measurement unit None
Fine alignment Contact type
Qty of grind axis One station
Spindle [1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[2] Vertical circumference contouring (finish)
Resin-bonded wheel (50mm)
Washing unit None
Diameter measurement None

Wafer Edge Grinder CVP-211B

Summary
  • The CVP series has been developed for higher precision chamfering through the use of a vertical grinding (contouring) wheel.
  • The CVP series chamfers the wafer edge to form a trapezoid or radius shape by using a single resin-bonded wheel.
  • Asymmetric grinding of the device wafer prior to BG results in a reduction of wafer breakage or chipping after BG.
  • Compact design,Single grinding station
Feature
  • Single grinding station.
  • Compact design. Footprint was downsized by 37%, compared to the conventional machine, CVP-110.
  • Grinds hard-material wafers (sapphire, SiC, GaN, crystal, quartz) with high precision and no chipping.
  • Minor change enables twin-contouring.
  • "Twin-contouring" method provides enhanced processing accuracy & shortened processing time, compared to the conventional CVP-210B.
Basic specifications
Wafer type OF(CF) or Notch
Wafer size 2-inch to 6-inch
Loading/Unloading 4-cassette
Thickness measurement unit Multi-point or a center point measurement (Optional)
Fine alignment Edge contact or Non-edge contact (selectable)
Qty of grind axis One station
Spindle [1] Horizontal circumference grinding (coarse)
Metal-bonded wheel (100mm) (Optional)
[2] Vertical circumference contouring (finish)
Resin-bonded wheel (60mm)
[3] Vertical circumference contouring 2 (finish)
Resin-bonded wheel (60mm) (Optional)
[4] Notch grinding (horizontal)
Metal-bonded wheel (Optional)
Washing unit Included (Edge polishing, 2-fluid washing, high-pressure jet can be included.) (Optional)
Diameter measurement Included

Inquiries

Daito Electron Corporation Business promotion department
Product Inquiry